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Pre-Manufacturing

Pre-Manufacturing

• Rapid prototyping
• Circuit Board Schematics and Layout Design
• Proof of Concept
• Design for Manufacturability (DFM)
• Design for Assembly (DFA)
• Design for Interconnection and Packaging
• Design for Test (DFT)
• Prototype Manufacturing

Post-Manufacturing

Manufacturing

• Materials management & component purchasing
• Rigid and Flex electronic assembly
• Complete range of component assembly
• Lead Free Processing
• Conformal Coating
• Test Development
• Environmental Stress Test (EST)
• Functional, ICT, and Boundary Scan Testing
• System Integration
• Packaging and customized documentation

Manufacturing

Post-Manufacturing

• Upgrade
• Repair Services
• BGA Rework & Re-balling

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All-inclusive Electronics Manufacturing Solutions: Pre-Manufacturing, Manufacturing and Post-Manufacturing.

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Latest Posts

A blue electronics board

Characterization of BGA solder joints using X-ray imaging

X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight...

Stencil

BGA/area array stencil aperture : Round or Square?

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer...

Electronic board

Why do you get a bridge under BGA even though X-ray image is very clean

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances...

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Circuits Central

169 Idema Road
Markham, ON L3R 1A9 Canada

Phone: (416) 285-5550
Toll-Free: 1 (888) 568-6550
Fax: (416) 285-4800
Email: info@circuits-central.com