Blog Header

By: Hooman Javdan

A blue electronics board
Characterization of BGA solder joints using X-ray imaging
March 7, 2016

X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight…

Read More
Stencil
BGA/area array stencil aperture : Round or Square?
February 29, 2016

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer…

Read More
Electronic board
Why do you get a bridge under BGA even though X-ray image is very clean
February 4, 2016

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances…

Read More
No-load Board
No-load list
February 4, 2016

Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly…

Read More