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Characterization of BGA solder joints using X-ray imaging

X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight...


BGA/area array stencil aperture : Round or Square?

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer...

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Why do you get a bridge under BGA even though X-ray image is very clean

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances...

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