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A blue electronics board

Characterization of BGA solder joints using X-ray imaging

X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight...

Stencil

BGA/area array stencil aperture : Round or Square?

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer...

Electronic board

Why do you get a bridge under BGA even though X-ray image is very clean

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances...

No-load Board

No-load list

Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly...

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