Innovative Electronics Manufacturing Solutions
Pre-Manufacturing . Manufacturing . Post-Manufacturing
- Materials management & component purchasing
- Rigid and Flex electronic assembly
- Complete range of component assembly
- Lead Free Processing
- Conformal Coating
- Test Development
- Environmental Stress Test (EST)
- Functional, ICT, and Boundary Scan Testing
- System Integration
- Packaging and customized documentation
Characterization of BGA solder joints using X-ray imaging
X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight...
BGA/area array stencil aperture : Round or Square?
What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer...
Why do you get a bridge under BGA even though X-ray image is very clean
X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances...
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169 Idema Road
Markham, ON L3R 1A9 Canada
Phone: (416) 285-5550
Toll-Free: 1 (888) 568-6550
Fax: (416) 285-4800